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Recommended Seal Materials by Process Applications
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Compound
Name |
Features and Benefits |
Service Temp Range |
Wet vs.
Dry |
Static vs.
Dynamic |
Primary Choices for Processes (Bold) |
Applications |
| Chemraz 513 |
Good plasma resistance
Good physical properties
Minimal contamination
Excellent performance history as "universal product"
|
-30 to 210ºC
(-22 to 410ºF)
|
Dry |
Static |
Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Ion Implant
Implant Anneal
RTP
|
Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals
|
| Chemraz 520 |
Excellent plasma resistance
Outstanding physical properties
Low contaminants
Withstands higher sealing loads
Excellent performance history in higher temperature applications
|
-30 to 240ºC
(-22 to 464ºF) |
Dry |
Static
and
Dynamic |
Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Oxidation (LPCVD)
Diffusion
Ion Implant
Implant Anneal
RTP
|
Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals
|
| Chemraz 550 |
Good chemical resistance
Good physical properties
Used where contamination requirements are less critical
Excellent performance history
|
-30 to 210ºC
(-22 to 410ºF) |
Wet |
Static
and
Dynamic |
Wet Etch (acid, base)
Wet Stripping (solvents)
Wet Cleaning (UPDI)
Wet Metal Plating |
Valve Seals, Fitting and Union Seals, Gaskets, Regulator Seals, Filter Seals |
Chemraz 570
Chemraz 571 |
Very low contaminants
Extended performance and added reliability
Good physical properties
Excellent performance history in wet systems
|
-30 to 210ºC
(-22 to 410ºF) |
Wet |
Static |
Wet Etch (acid, base)
Wet Stripping (solvents)
Wet Cleaning (UPDI)
Wet Metal Plating
Chemical Mechanical Planarization (CMP) |
Valve Seals, Fitting and Union Seals, Gaskets, Regulator Seals, Filter Seals |
| Chemraz 592 |
Excellent physical properties
Inert filler system ensures excellent resistance to plasma attack
|
-30 to 240ºC
(-22 to 464ºF) |
Dry |
Static
and
Dynamic |
Dry Ashing (O2)
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Ion Implant
Implant Anneal
RTP |
Slit Valves, Endpoint Windows, Window Seals, Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Isolator Valve Seals, Bell Jar Seals |
| Chemraz 655 |
Service temperatures up to 315ºC
Excellent balance of physical properties
Minimal contamination
Withstands a variety of aggressive chemicals
Unlimited design flexibility |
-20 to 315ºC
(-4 to 600ºF) |
Dry |
Static
and
Dynamic |
Rapid Thermal Processing (RTP)
Diffusion
Oxidation (LPCVD)
Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Implant Anneal |
Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals,
KF Fitting Seals, Chamber Seals, Valve Seals, Endpoint Windows |
| Chemraz 653 |
Excellent plasma resistance
Used where contamination requirements are less critical
Suitable for higher temperature applications
Superior compression set |
-18 to 324ºC
(0 to 615ºF) |
Dry |
Static
and
Dynamic |
Oxidation (LPCVD)
Diffusion
RTP
Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Implant Anneal |
Quartz Rod Seals, Bell Jar Seals, High Temperature Valve Seals, KF Fitting Seals |
| Chemraz 639 |
Exceptional plasma resistance in oxygen and fluorine environments
Minimal particulation and surface degradation
High purity, very low metallic ion content
|
-20 to 260ºC
(-4 to 500ºF) |
Dry |
Static
and
Dynamic |
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PVD, sputtering, evaporation) |
Endpoint Windows, Bell Jar Seals, Valve Seals, KF Fitting Seals, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, Slit Valve Seals, Chamber Seals |
| Chemraz E38 |
Minimal contamination
Withstands a variety of aggressive chemicals
Excellent physical properties
Low metal ion content
Unlimited design flexibility
Suitable for higher temperature applications
|
-20 to 260ºC
(-4 to 500ºF) |
Dry |
Static
and
Dynamic |
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Remote Plasma Cleans
Oxidation (LPCVD)
Diffusion
Metalization
(CVD, PVD, sputtering, evaporation)
Dry Plasma Etch
Dry Ashing
Ion Implant
Implant Anneal
RTP |
Bonded Gate Seals, Chamber Seals |
| Chemraz 661 |
Minimal particulation
Maximum plasma resistance
Withstands a variety of aggressive chemicals
Excellent physical properties
Unique filler system
|
-20 to 260ºC
(-4 to 500ºF) |
Dry |
Static
and
Dynamic |
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PVD, sputtering, evaporation)
Ion Implant
Implant Anneal
RTP |
Endpoint Windows, Bell Jar Seals, Valve Seals, KF Fitting Seals, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, Slit Valve Seals, Chamber Seals |
Fluoro-
elastomer 742 |
Outstanding physical properties
Conforms well to handware features
Used where contamination requirements are less critical
Good performance history in chemically aggressive systems
|
-30 to 250ºC
(-22 to 482ºF) |
Dry
and
Wet |
Static
and
Dynamic |
Metalization (CVD, PVD, sputtering, evaporation)
Ion Implant
Oxidation (LPCVD)
Diffusion
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Wet Etch (acid, base)
Wet Cleaning (UPDI)
Wet Metal Plating
Implant Anneal
RTP |
Door Seals, Slit Valves, Window Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Valve Seals, Gaskets, Fitting and Union Seals |
Fluoro-
elastomer 931 |
Outstanding physical properties
Used where contamination requirements are less critical
Superior performance under higher sealing loads
Good performance history in chemically aggressive systems
|
-30 to 250ºC
(-22 to 482ºF) |
Dry
and
Wet |
Static
and
Dynamic |
Ion Implant
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Wet Etch (acid, base)
Wet Cleaning (UPDI)
Wet Metal Plating
Implant Anneal
RTP |
Door Seals, Slit Valves, Window Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Valve Seals, Gaskets, Fitting and Union Seals |
| Fluoraz 888 |
Outstanding physical properties
Good performance history in aggressive chemicals
>Conforms well to hardware features
|
0 to 230ºC
(-20 to 446ºF) |
Dry
and
Wet |
Static
and
Dynamic |
Metalization (CVD, PVD, sputtering, evaporation)
Dry Plasma Etch
Ion Implant
Oxidation (LPCVD)
Diffusion
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Remote Plasma Cleans
Dry Ashing
Implant Anneal
RTP |
Valve Seals, KF Fitting Seals, Window Seals, Lid Seals, Gas Inlet Seals, Chamber Seals, Door Seals, Gaskets, Fitting and Union Seals, Slit Valves |
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